Abstract |
In recent years, group III nitride semiconductors have increasingly attracted the attention
of the research community in the field of optoelectronics due to their unique properties.
More specifically, regarding the fabrication of microcavities that operate in the strong
coupling regime, GaN has been found to allow the operation of high‐performance polariton
devices at room temperature.
In the context of this paper, a series of samples with a different number of GaN/AlGaN
polar quantum wells over a c‐axis grown InGaN/GaN layer was designed and grown. In
parallel, with a view to restrict the spontaneous and piezoelectric polarization fields which
are found in polar structures and affect the performance of c‐plane photonic devices, a nonpolar
(m‐plane) sample with the same structure was fabricated. Before any sample
treatment is initiated, photoluminescence and reflectance measurements were carried out
in order to examine the excitonic properties and crystal quality of polar and non‐polar
quantum wells.
The ultimate goal was to fabricate free‐standing GaN/AlGaN membranes, having a
thickness of ~200nm, corresponding to a 3λο/2nc structure with λο=360nm and nc the
effective refractive index of the cavity. This was achieved using the method of selective
photo‐electrochemical etching for the lateral removal of the InGaN layer. The most
important part of this wotk was that non polar membranes were fabricated by this
technique. Next, the membranes created were transferred onto dielectric mirrors known as
Distributed Bragg Reflectors (DBR), thus forming a half‐microcavity which was completed by
placing the dielectric top mirror. In general, rather uniform membranes, properly
incorporated into the dielectric mirrors, were observed, despite the fact that, in several
cases, the membranes appeared to be strained (curved) upon placement of the dielectric
top mirror. In our first effort to understand this behavior, we examined whether the
mismatch in coefficients of thermal expansion between GaN and DBR materials affects the
membrane curvature. Consequently, in SiO2/Ta2O5 mirror that has been used until recently,
SiO2, with the lowest thermal expansion coefficient compared to other materials, was
replaced by Al2O3, without any particular improvement achieved. On the other hand, by
reducing the temperature of mirror deposition from 300°C to 150°C and the number of
periods, the membrane curvature was minimized.
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